5911900010
Self adhesive circular polishing pad for semiconductor wafer manufacturing
Refer to Note 8 in Chapter 59Declaration Elements
0: Brand type
1: Export benefits situation
2: Usage (such as semiconductor wafer manufacturing, etc.)
3: If it is used for semiconductor wafer manufacturing, it is necessary to indicate whether it is self-adhesive
4: If it is for semiconductor wafer manufacturing, please note whether it is circular or not
5: Ingredient content
6: Brand (Chinese or foreign name)
7: Model number
8:GTIN
9:CAS
10: Other
By each trade agreement
RCEP
Directory
ChinaChina HS CodeSection 11Textile raw materials and textile products59Textile fabrics that are impregnated, coated, wrapped, or laminated; Industrial textile products5911Textile products and products for specialized technical purposes as specified in Note 7 of this chapter591190Textile products and products not designated for specialized technical purposes59119000Textile products and products not designated for specialized technical purposes5911900010Self adhesive circular polishing pad for semiconductor wafer manufacturingCIQ
Self adhesive circular polishing pad for semiconductor wafer manufacturing (see Note 8 in Chapter 59)
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