3919909010
Self adhesive circular polishing pad for semiconductor wafer manufacturing
Declaration Elements
0: Brand type
1: Export benefits situation
2: Usage (such as semiconductor wafer manufacturing, etc.)
3: Appearance (board, sheet, film, foil, tape, flat strip)
4: Is it rolled up
5: Is it single-sided self-adhesive
6: Ingredients
7: Specification and size
8: If it is used for semiconductor wafer manufacturing, the shape (such as circular) needs to be specified
9: Brand (Chinese or foreign name)
10: Model number
11:GTIN
12:CAS
13: Other
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Self adhesive circular polishing pad for semiconductor wafer manufacturing
Disclaimer
The data on this page is sourced from publicly available information and is for reference only. It has no legal effect. Actual procedures should be based on the latest Import and Export Tariff Schedule and relevant laws and regulations issued by the General Administration of Customs.





